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October 2001

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TechNet <[log in to unmask]>
Subject:
Copper migration
From:
"Yuen, Mike" <[log in to unmask]>
Date:
Fri, 5 Oct 2001 11:14:09 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>
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Greeting to all:

I am interested to know how easy can copper on the PCB to migrate thru
the intermetallic layers during or after the reflow process, provided
the PCB finish is HASL. 

Thank you in advance for all the help.....

M. Yuen

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