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February 1999

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TechNet <[log in to unmask]>
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Date:
Fri, 5 Feb 1999 20:30:11 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Wolfgang Erat <[log in to unmask]>
Subject:
Re: Rework information
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From:
Wolfgang Erat <[log in to unmask]>
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Buenas Dias Enid

how do you remove the solderpaste ?
to your question:
you should build up sufficient thickness, min of 30 microinches
then, you should do tapetesting for adhesion, use standard masking tape for
this.

[log in to unmask]

-----Message d'origine-----
De : [log in to unmask]
<[log in to unmask]>
Ŕ : [log in to unmask] <[log in to unmask]>
Date : February 19, 1999 7:35 AM
Objet : [TN] Rework information




> ----------
> From:
[log in to unmask][SMTP:[log in to unmask]
M.HP.COM]
> Sent: Thursday, February 18, 1999 2:18:50 PM
> To: [log in to unmask]
> Subject: [TN] Rework information
> Auto forwarded by a Rule
>
Gold contact rework

We are replating gold contacts that has been contaminated with solder
paste.  The process is to remove the solder paste from the contacts, clean
the area and then apply gold using the same principle of pcb gold plating.
Is there any reliability issue with such process?  Is there any particular
analysis to validate the process?

Any information in this matter will be helpful.

Enid Dávila

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