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September 1997

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TechNet <[log in to unmask]>
Subject:
SMT Coplanarity issues
From:
Steve Collins <[log in to unmask]>
Date:
Thu, 25 Sep 1997 10:34:27 -0600
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"TechNet Mail Forum." <[log in to unmask]>, Steve Collins <[log in to unmask]>
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What is the proper amount of solder that should be on an SM Component pad
after HASL. IPC calls for "Coverage and Solderable" but what does this
really mean. My curiosity is sparked by our entry into the fine pitch arena
and our vendors ability to give production what they need.

I have gone back to our internal production people and requested that they
supply us with their requirements.

Steve Collins
PCB Design Supervisor
Antec Network Technologies
[log in to unmask]

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