I am curious about the 3.543 uin dielectric spacing recommendation in
6012C 3.6.2.15. I have to believe that this

Number did not just come out of thin air. I have been searching for any
long term reliability issues related to going below this number. I know
that HDI structures and embedded capacitors use very thin dielectrics
and the spec recommends low profile copper when going below this number.
We are doing Class 3 boards  and I am just trying to make sure I am not
shooting myself in the head going below this number. 

Thanks in advance


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