TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipchq.com (Smail3.1.28.1 #2) id m0t0u0D-0000H7C; Thu, 5 Oct 95 12:22 CDT
Sender:
Old-Return-Path:
<[log in to unmask]> <miso!a1.ALLIN1.umc!marsico>
Date:
Thu, 05 Oct 95 15:17:01 -0400
Precedence:
list
Resent-From:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/1292
From [log in to unmask] Sat Apr 27 15:
00:33 1996
TO:
Return-Path:
Posted:
Thu, 05 Oct 95 16:59:01 -0400
Resent-Message-ID:
<"61hj-1.0.303.2G1Tm"@ipc>
Subject:
From:
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc>
Msg-Class:
ALL-IN-1 IOS Server for VMS V3.0 PBL123A (US) ENGLISH 21-MAR-1992
X-Loop:
Message-Id:
<61803150015991/98221@ALLIN1>
Parts/Attachments:
text/plain (6 lines)
Do fluxes and solder pastes which met the requirements (and are on the QPL) of 
the Mil Specs (MIL-F-14256 and QQ-S-571	respectively) automatically qualify to 
the IPC replacement documents (J-STD-004 & -005)?



ATOM RSS1 RSS2