TECHNET Archives

October 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
X-To:
Date:
Fri, 9 Oct 1998 09:44:06 EDT
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Content-type:
text/plain; charset=US-ASCII
Subject:
From:
Michael Pavlov <[log in to unmask]>
Content-transfer-encoding:
7bit
Parts/Attachments:
text/plain (22 lines)
I would like to add that Cu56 protected copper might survive even after three
reflows but in nitrogen.

Check also the proceedings of IPC' 98 National Conerence on PWB Surface
Finishes and Solderability. There is some information about OSPs.

Regards
Michael Pavlov
ECI

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2