TECHNET Archives

May 2012

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Wed, 30 May 2012 03:11:28 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Martin Bayes <[log in to unmask]>
Subject:
Re: Phosphorus at the BGA pad
MIME-Version:
1.0
Message-ID:
<[log in to unmask]>
Content-Type:
text/plain; charset="UTF-8"
Content-Transfer-Encoding:
quoted-printable
From:
Martin Bayes <[log in to unmask]>
Parts/Attachments:
text/plain (9 lines) 
Hi Per-Erik

An example of a typical application for electrolytic Ni-P would be as an underlayer for electrolytic gold in connector pin applications. The better barrier properties of the Ni-P deposit can allow use of reduced gold thicknesses.

In that case, a solder connection would be made to the base of the connector pin.  However, solder joint volume and soldering conditions would be quite different to a PWB component attachment situation.

Regards
Martin

ATOM RSS1 RSS2