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June 2000

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TechNet <[log in to unmask]>
Subject:
Chip backside metal
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Date:
Wed, 7 Jun 2000 15:49:13 +0200
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"TechNet E-Mail Forum." <[log in to unmask]>, "Ingemar Hernefjord (EMW)" <[log in to unmask]>
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Short q: Ag/Ni/Cr, what do you like that chip backsides for attaching power FETs? Ag is 90%.  Unusual? IRC make such backside metalizing. Wonder why...I'm somewhat concerned, Ag migration and strange intermetallics may occur, depending on what solder or glue you use. Anyone mounting these creeps? Steve?
Ingemar Hernefjord
Ericsson Microwave Systems

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