We are plating copper onto wafers with the plated area dimensions being
in Micron (E-6 meters) level. We are seeing bubbles in plating tanks
that are causing unplated areas or depressions in plated areas.

Our EE group has tried and has given up on the tanks and how far they
can go fixing the tanks.



Does anyone out there know any degassing equipment or bubble sensors or
something that can detect and eliminate bubbles.



Thanks & Regards,

Yasmeen


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