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July 2003

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TechNet <[log in to unmask]>
Subject:
Urgent request
From:
Lum Wee Mei <[log in to unmask]>
Date:
Thu, 31 Jul 2003 14:00:52 +0800
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"TechNet E-Mail Forum." <[log in to unmask]>, Lum Wee Mei <[log in to unmask]>
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Hello,

Can someone advice on what type of bond or adhesive to use to bond a
Rohacell foam to dupont kapton film (similar to those used in flex
circuit)? The material must be withstand thermal, vibration and shock
and has very low dielectric loss at microwave frequencies?

Regards,
Wee Mei

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