Steve:

      I' ve worked with the Dynachem and the Dupont dry film. To me it looks
the problem is pre clean prior to dry film application. The film seems to be
peeling from all Cu. surfaces, vias and traces. I don't think the plating is
to high on the surface.
( Its kind of hard to plate 4 mils of copper unless the operator fell asleep)

     Try tape testing the assem. before processing for mask peel.

       Hope it helps

                          Frank


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