 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uoBcT-0000P1C; Wed, 7 Aug 96 11:38 CDT |
| Old-Return-Path: |
|
| Date: |
Wed, 7 Aug 1996 11:45:26 +600 CDT |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| Priority: |
normal |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| X-Mailing-List: |
|
| From [log in to unmask] Wed Aug 7 12: |
49:12 1996 |
| X-Confirm-Reading-To: |
|
| Resent-Message-ID: |
<"EuC0u2.0.UWH.hPC2o"@ipc> |
| Subject: |
|
| From: |
|
| X-Mailer: |
Pegasus Mail for Windows (v2.23) |
| Resent-Sender: |
|
| Organization: |
CompuRoute, Inc. |
| Message-Id: |
|
| Parts/Attachments: |
|
|
Eugenio,
As written earlier, I highly recommend Multichip Module Design,
Fabrication and Testing from Licari (McGraw Hill, 1800 2624729).
Of several literatures and books I have read and put to use, this
is sure to teach you the basics on MCMs (Multi Chip Modules).
However, the -L is an MCM constructed of Laminates and the -C is
constructed of Ceramics. And then you have MCM-Ds which are THIN
FILM DEPOSITED, very similar to wafer fabrication. MCMs are used
in several package types TAB (Tape Automated bonding) and COB
(Chip on Board).
Regards,
John Gulley - Process Engr
Compuroute Inc.
Dallas, TX
> From: [log in to unmask]
> Date: Wed, 7 Aug 96 09:33:05 EDT
> To: [log in to unmask], [log in to unmask]
> Subject: Re: GEN: Electronic Component Packaging Specs.
> Eugenio,
>
> MCM stands for Multi Chip Module which is a high density packaging and
> interconnect approach. the -L and -C stand for the type of substrate. I
> believe -L is organic, -C is non-organic.
>
> IPC-MC-790 Guidelines for MultiChip Module Technology Utilization is a good
> place to start.
>
> Jeff
>
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to: *
> * [log in to unmask] with <subject: unsubscribe> and no text. *
> ***************************************************************************
>
>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
