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February 2000

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Subject:
From:
"Dieselberg, Ron" <[log in to unmask]>
Date:
Tue, 29 Feb 2000 12:46:17 -0500
MIME-Version:
1.0
X-To:
William Plumbridge <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Dieselberg, Ron" <[log in to unmask]>
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William, I took a look at your web page and printed off some things for
later reading. Please be advised that the address posted contains a sintax
error. (Change the dash between "tec" and "open" to a dot.) Thank you for
your information.
Ron Dieselberg
BAE SYSTEMS Cincinnati Electronics Corp.

-----Original Message-----
From: William Plumbridge [mailto:[log in to unmask]]
Sent: Tuesday, February 29, 2000 09:26
To: [log in to unmask]
Subject: [TN] Hello Everybody!


As a new subscriber to TechNet, I'd like to introduce The Solder Reseach
Group at the Open University.

I must admit that I do not understand much of the the detailed discussions
that are going on.

Our interests are with the performance of solders and solder joints in
service. We assume that everyone has made a sound joint !!

Naturally, we are studying the popular lead-free alloys. We have an
excellent range of mechanical testing equipment including the ability to
test at temperatures down to -60C.

For more detail about us see

http:/www-tec.open.ac.uk/materials/srg/srg-hp.html


or ask for a brochure.

Look forward to hearing from you

Bill Plumbridge

( Professor of Materials,  Director of the Solder Research Group)

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