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September 1999

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From:
"Christian Skeppstedt (EMW)" <[log in to unmask]>
Date:
Mon, 27 Sep 1999 08:58:15 +0200
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"TechNet E-Mail Forum." <[log in to unmask]>, "Christian Skeppstedt (EMW)" <[log in to unmask]>
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Hello,

We have a problem with contaminated substrates and we are considering to use plasmacleaning to enhance wire bonding and reduce epoxy bleedout. Does anyone have any experience from this topic?

Does anyone out there know how plasmacleaning with Ar and/or O2 affects Si- and GaAs components?

Regards,
Christian Skeppstedt
Ericsson Microwave Systems

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