Hi Lou!

I would take all the socketed components out first before cleaning
them...only because of the chance that some of the cleaning solution could
get trapped in the socket pins and not be rinsed out. Everything else should
be okay...

-Steve Gregory-


In a message dated 09/08/2000 4:22:04 PM Central Daylight Time,
[log in to unmask] writes:

> TechNetters,
>
>  We have here some assemblies that were in a building (a customer's, not
ours)
>  that leaked during a rain storm.  Various portions of them have a dirty
> deposit that is curiously tenacious, by which I mean it is easily scraped
off,
>  but cannot be removed by blowing or light wiping.
>
>  We are considering running the assemblies through our conveyorized
cleaning
> process, but are not sure which components can tolerate it.  The wash
> solution is a 130 F, 9% solution of monoethanolamine (we use an RMA flux).
> 130 F water rinse follows.
>
>  May I get some advice about what to do with these components?  Can they go
> through our cleaning process?
>
>
>  DIPs in sockets
>  Pin Grid Arrays in sockets
>  Quad pack ICs in tin contact sockets
>  'D' connectors, male (I think that's what they're called, they have a
metal
> shell sticking out around the pins)
>  DIN connectors, male and female (rectangular, grey plastic housing)
>  LEDs in plastic housings
>  "Cannon" connectors, male (if that is the correct terminology, they have
> heavy pins sticking in an array out of a plastic block)
>
>  Thanks for any comments.
>
>  Lou Hart
>  Compunetix
>  Quality Assurance
>  412-858-6184

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