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| >From willli Mon Jun 16 10: |
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To: Last few em, concerning the stripping of lpism after thermal curing.
Epoxy based lpism are practically impossible to strip and it is my
recommendation that you not attempt to strip these boards. The main problem
is attack of the butter layer by the solvent in the stripping chemistry and
the heat effect.
Aqueous lpism can be stripped by a proprietary chemistry (RBP-CHEMELEX
solder mask remover), within 3 hours at about 130 F. The butter layer is
not attacked by any harsh solvents and the immersion time is greatly
reduced from the 48 hours, previously described, hence the heat effect is
greatly reduced.
Good Luck,
Lenny Kurup
[log in to unmask] (for more details)
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