TECHNET Archives

September 2014

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset="utf-8"
X-To:
Date:
Fri, 19 Sep 2014 09:17:24 -0400
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Message-ID:
Content-Transfer-Encoding:
quoted-printable
MIME-Version:
1.0
Sender:
Parts/Attachments:
text/plain (17 lines)
‎I'm trying to find information on whether Sn-Bi based solders are susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based solders do.

I don't see why they wouldn't but need some confirmation. 

As always, thank you very much in advance for constructive answers.

Regards,

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2