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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 Dec 1999 07:49:10 -0500 |
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Morning Steve,
You've probably already looked at this but in case you didn't: verify the
component specifications to ensure the elevated temperature will not cause
degradation.
You should set your oven to provide a soak temperature of no more than 100C
below the liquidus temperature -- this too relates to thermal shock.
Like other solder pastes, the manufacturer should provide the recommended
reflow profile -- then tweek based upon your assembly density to achieve
that end.
Good Luck
Steve Sauer
Xetron Corporation
-----
Steve said..... So should I follow the same rules of thumb when it comes
creating a profile
for this stuff...ya' know; don't ramp more than 2-4º C per second, pre-heat
and soak above 150º C for around a minute and a half, then spike it until
you're 20-30º above liquidous, and try to be less than a minute while you're
above liquidous? Or is there some special stuff I should do differently with
this higher melting point temperature alloy?
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