TECHNET Archives

August 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show HTML Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
From:
Jan Bokhove <[log in to unmask]>
Date:
Thu, 7 Aug 1997 11:10:27 +0200
Content-Type:
text/plain; charset="us-ascii"
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Jan Bokhove <[log in to unmask]>
Parts/Attachments:
text/plain (22 lines)
*****  Unclassified  *****
>
>I have been told that gold and silver are incompatible materials for
>bonding together, and that, therefore, gold finishes and silver-filled,
>electrically conductive adhesives will not work well together.  Does
>anyone have any data to corroborate or contradict this information?
>
>Steve Murphy
>
-------------------------------------------------------------------------------

Steve,

We have a very long experience with silver-filled, electrically conductive adhesives on gold. We use it, among others, for die bonding. We have never experienced problems due to incompatability between gold and silver. We have seen problems with both materials in combination with PbSn solders, maybe thats where this 'rumour' comes from.
Hope this helped.......
Jan Bokhove
Dep. CQM
Hollandse Signaalapparaten
tel. +31 74 2482949
e-mail [log in to unmask]


ATOM RSS1 RSS2