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| From [log in to unmask] Tue Dec 3 14: |
41:33 1996 |
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>From what you have said it is is the solder paste in the holes causing the
outgassing and the voiding which does happen with via hole mounting due to
restriction of solvent evaporation from the holes. The Entek is not relevant to
the problem you describe.
If it were the boards then use the outgassing test I have talked and posted on
the Technet many times. My outgassing test video also shows how to test boards.
I have been doing via hole mounting and if you get the profile correct you do
not get gassing.
Bob Willis
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/Bwillis
Email: [log in to unmask]
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