I always thought the reduction was to allow for component terminations and
lead protrusion. I could be wrong. This spec was adapted from Mil-D-275.
Sometimes things got lost in the translation, but mostly when trying to
include some provision for Class 1 or 2 products. I don't think the table
was compromised.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brinkman, Mark
Sent: Friday, September 23, 2005 11:56 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-2221 conductor spacing
I'm just looking for answers, any opinion and/or analysis helps.
Mark
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(AZ75)
Sent: Friday, September 23, 2005 10:20 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-2221 conductor spacing
Do want a cross-section of public opinion on this or a Gap Analysis on
the differences?
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brinkman, Mark
Sent: Friday, September 23, 2005 8:02 AM
To: [log in to unmask]
Subject: [TN] IPC-2221 conductor spacing
Can anyone clarify why A6's clearances for non-conformally coated lands
is less than B2's clearances for unmasked and non-conformally coated
conductors? I would consider a land a conductor and thus I would think
B2 applies to lands also. Also, I assume the polymer coating B4
references is solder mask and that it is only applicable when it covers
the conductor and that solder mask between conductors does not factor
into spacing i.e. solder mask between 2 uncoated lands doesn't allow the
lands to be closer.
Does anybody have any thoughts on this?
Thanks
Mark Brinkman
Honeywell CES
23500 W. 105h Street, Olathe, KS. 66061
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