Pete,
 Do you have analysis that shows the separation you are experiencing is
an adhesion of the electroless nickel to the electoplated copper?  I'm
assuming you are seeing some separation of a part soldered to a ENIG
board (Cu/ENi/IAu).  If you are seeing a "clean - flat" separation I'd
look to see if it is a brittle fracture beween an IMC and the ENi.
 

Regards, 
George 

George M. Wenger (908)-546-4531 [log in to unmask] 
Distinguished Member Technical Staff 
Celiant Corporation, FMA Lab, 40 Technology Drive, NJ 07059 

-----Original Message-----
From: Peter Nemcik [mailto:[log in to unmask]]
Sent: Thursday, February 28, 2002 8:21 AM
To: [log in to unmask]
Subject: [TN] Electroless nickel to electroplated copper separation


Can somebody shed some light on possible causes of adhesion problems
between electroless nickel and electroplated copper, that occur at
random intervals? Analysis of both baths show they are in order, and the
nickel plating is not permitted to dry or passivate before going into
the copper.

Thanks in advance

Pete




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