Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 28 Jun 2001 16:26:54 EDT |
Content-Type: | multipart/alternative |
Parts/Attachments: |
|
|
In a message dated 6/28/2001 3:20:58 PM Central Daylight Time,
[log in to unmask] writes:
> In addition, we all know that HASL is a nasty, dirty, filthy, rotton (fill
> in the descriptor of your choice) process and often leaves nasty, dirty
> filthy rotton residues behind. It does nasty things to insulation
> resistance. If you are going the no-clean route, HASL residues can kill
> your product and sometimes, users of your product. By comparison, OSP is a
> much cleaner process and does not impact insulation resistance.
>
Amazing that any planes are still flying or equipment is still functioning
after all
these years of that "nasty" process that has provided adequate product.
Susan Mansilla
|
|
|