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Subject:	Re: Test Method/Qual Report
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 13 Mar 2002 19:04:25 -0600
Content-Type:	multipart/alternative
Parts/Attachments:	text/plain (2190 bytes) , text/html (2947 bytes)

Pleased to assist, Jeff. It's a brand new document IPC-9701; here's some info about it. There's also been some discussion about it you'll probably find in the TechNet archives. Jack

IPC-9701

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments. 24 pages. Released January 2002.

HARD COPY: $40, ELECTRONIC $30 but IPC members get 50% discount on these prices.

>>> [log in to unmask] 03/13/02 02:04PM >>>
Technetters,

Looking for a report titled "Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments". Sounds like an IPC
document but can't track it down. Anyone know where I can look?

Thanks,

Jeff Ferry
CEO
Circuit Technology Center, Inc.
www.circuittechctr.com
[log in to unmask]
978-374-5000

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