Hi Bob,
I sure do not of any industry document addressing your issues.
With traces running this hot, there certainly is a reduction in peel
strength. On the other hand, the CTE's of the FR-4 and the ED-Cu are very close—unless
you have frequent on/off's, the T's of the PCB and the Cu traces will not be
that much different either. So. whatever thermal ecpansion mismatch may exist,
either in steady-state or dynamically, should be small enough to be
accommodated by the ED-Cu ductility.
Werner
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