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March 2003

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TechNet <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>
Date:
Wed, 19 Mar 2003 16:00:37 +0800
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Subject:
The relations between mulit-layers and thermal transition
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Jason Cheng <[log in to unmask]>
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Hello everyone.



I'm curious about the effect of thermal transition if we used a multi layer

PCB in large copper foil.

I have an experience that I have measured two corner of a BGA which mounted

on the PCB I mentioned above.

But I can see a large difference of melting time between each corner.

About 10 to 15 seconds delayed.



Could someone help me to explain the condition and give some experience or

suggestions to me?





Thanks







DLINK corp.

SMT Engineer

Jason Cheng

E-mail: [log in to unmask]

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