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Date: | Thu, 13 Sep 2007 09:08:32 +0100 |
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Unleaded ALPHA 0M325, PCB is gold finish.
Thanks
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cheryl L. Johnson
Sent: 12 September 2007 19:24
To: [log in to unmask]
Subject: Re: [TN] Thermal issue's with unleaded solder paste.
What specific lead-free solder and pcb finish are you using?
--
Cheryl Johnson
(303) 485-8829 home
(303) 809-5815 cell
-------------- Original message ----------------------
From: "Thomas, Ian (Ian) %" <[log in to unmask]>
> Hi, Need some useful advice regarding a current design.
> I have a 12 layer FR4-370HR PCB, using stacked uvia's in pad which
> connect to planes on layers 2 & 3 which are flooded with no thermal
> relief.
>
> We have seen no issue's with leaded assembly, but on transferring over
> to un-lead, we are seeing solder issue's with the BGA's (0.5mm pitch)
> on assembly and also rework issuse's with 90% of the other components
> (including
> 0402's) in getting them off the board.
>
> Our first thoughts are to thermally relieve all the micro via's, but
> there are issue's because this may leave you with only one spoke on a
> pin in some areas.
>
> Has any seen these issue's before?
>
> Thank's in advance.
>
> Ian
> LSI Technology (Mobility)
>
>
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847-615-7100 ext.2815
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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