TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
Reliability of reworked PCB's
From:
Guenter Grossmann <[log in to unmask]>
Date:
Tue, 26 Aug 1997 09:14:31 +0200
Content-Type:
text/plain; charset="us-ascii"
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Parts/Attachments:
text/plain (11 lines) 
Hello

Has anybody done any testing on repaired PCB's in order to evaluate
(measure) changes in the reliability of compopnents and solder joints? The
definition of the failure is also of interest.

Best regards

Guenter

ATOM RSS1 RSS2