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November 2012

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TechNet <[log in to unmask]>
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Date:
Tue, 27 Nov 2012 19:01:30 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Julie Silk <[log in to unmask]>
Subject:
Re: Termination finishes, Cu thickness under Ag, Au-Pt-Pd
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The claim of the supplier is that the Pt prevents the Au from dissolving into the solder.  Hmmm.  Can anyone back that up? 
The recent info on this is that it's looking like a wettability problem more than a dissolving-into-the-joint problem, although neither is confirmed.

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