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Thu, 9 Jul 1998 10:03:56 -0700 |
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Hi Technetters,
I had some discoloration problem on random pad locations on Ni/Au plated
boards. Following is the response from my vendor, please prove me your comments.
" the average Ni thickness = 162 microinch
the average Au thickness = 5.8 microinch
They ran a solderability test which passed, verifying no contamination. The
belief is that the Ni sometimes dispositions rougher, leaving a semi-mat
color versus the normal shinny disposition, lending to a variance in the
Gold coloring in some areas. Due to the immersion gold being a pure gold,
with a self eliminating thickness, this variance in color can and is more
prevalent than the thicker electrolytic Gold process. "
Note: Can you suggest any lab in San Jose/Milpitas Area where I can take
fabs to verify this?
re,
ken patel
______________________________________________________
Ken Patel Phone: (408) 490-6804
1708 McCarthy Blvd. Fax: (408) 490-6859
Milpitas, CA 95035 Beeper: (888) 769-1808
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