Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uR3fF-0000CeC; Tue, 4 Jun 96 16:29 CDT |
Old-Return-Path: |
|
Date: |
Tue, 04 Jun 96 16:32:16 EST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"wMTfG3.0._QH.mgAjn"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Wed Jun 5 17: |
24:47 1996 |
X-Loop: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
I have been investigating selective wave soldering. Results
to date have been less than desirable. The fixture is a
huge heat sink, non-metal. The objective is to keep my SMD
away from the wave while soldering a few through hole parts
and eliminate my glue operation. The first fixture I tried
held the CCA very high making it difficult to get successful
soldering. Current machines are two super modified, nitro
burning Hollis GBS Marks that have been modified with a High
Mass Preheats, and modified Hot Air Knives with very flat
CFM response curves. Also utilizing chip waves. I would
appreciate any and all recommendations or experiences you
would be willing to share. Thanks in advance. Ron From
Hollis Land.
|
|
|