There is also a wealth of information on flexible circuits from Technet's
sponsor, the IPC. Below is a large sampling also including some standards related
to HDI which often uses flex circuit technology.
Best to all,
Joe
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A2223,-APCB%20(Flex),-A2223%20-%20Sectional%20Design%20Standard%20for%20Flexible%20Printed%20Boards,-A,-A,-A">2223 - Sectional Design Standard for Flexible Printed Boards </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A4202,-APCB%20(Flex),-A4202%20-%20Flexible%20Base%20Dielectrics%20for%20Use%20in%20Flexible%20Printed%20Circuitry,-A,-A,-A">4202 - Flexible Base </A><A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A4204,-APCB%20(Flex),-A4204%20-%20Flexible%20Metal-Clad%20Dielectrics%20for%20Use%20in%20Fabrication%20of%20Flexible%20Printed%20Circuitry,-A,-A,-A">Dielectrics</A><A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A4202,-APCB%20(Flex),-A4202%20-%20Flexible%20Base%20Dielectrics%20for%20Use%20in%20Flexible%20Printed%20Circuitry,-A,-A,-A">for Use in Flexible Printed Circuitry </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A4203,-APCB%20(Flex),-A4203%20-%20Adhesive%20Coated%20Dielectric%20Films%20for%20Use%20as%20Cover%20Sheets%20for%20Flexible%20Printed%20Circuitry%20and%20Flexible%20Adhesive%20Bonding%20Films,-A,-A,-A">4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible
Printed Circuitry and Flexible Adhesive Bonding Films </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A4204,-APCB%20(Flex),-A4204%20-%20Flexible%20Metal-Clad%20Dielectrics%20for%20Use%20in%20Fabrication%20of%20Flexible%20Printed%20Circuitry,-A,-A,-A">4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible
Printed Circuitry </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A6013-K,-APCB%20(Flex),-A6013-K%20-%20Qualification%20&%20Performance%20Specification%20for%20Flexible%20Printed%20Boards%20&%20Amendment%201,-A,-A,-A">6013-K - Qualification & Performance Specification for Flexible Printed
Boards & Amendment 1 </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A6202,-APCB%20(Flex),-A6202%20-%20IPC/JPCA%20Performance%20Guide%20Manual%20for%20Single-%20and%20Double-Sided%20Flexible%20Printed%20Wiring%20Boards,-A,-A,-A">6202 - IPC/JPCA Performance Guide Manual for Single- and Double-Sided
Flexible Printed Wiring Boards </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AFA-251,-APCB%20(Flex),-AFA-251%20-%20Guidelines%20for%20Assembly%20of%20Single-%20and%20Double-Sided%20Flex%20Circuits,-A,-A,-A">FA-251 - Guidelines for Assembly of Single- and Double-Sided Flex Circuits </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AFLEX-CO-99,-APCB%20(Flex),-AFLEX-CO-99%20-%20IPC%20National%20Conference%20Flexible%20Circuits%20Volume%20I%20&%20II%20-%20Denver\%2C%20CO%201999,-A,-A,-A">FLEX-CO-99 - IPC National Conference Flexible Circuits Volume I & II -
Denver, CO 1999 </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AFLEX-TX-00,-APCB%20(Flex),-AFLEX-TX-00%20-%20IPC%206th%20Annual%20National%20Conference%20on%20Flexible%20Circuits:%20A%20Technology%20Comes%20of%20Age,-A,-A,-A">FLEX-TX-00 - IPC 6th Annual National Conference on Flexible Circuits: A
Technology Comes of Age </A>
New <A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AFLXCSP03-K,-APCB%20(Flex),-AFLXCSP03-K%20-%20">FLXCSP03-K - "Flex and Chips" - IPC International Conference on
Flexible Circuits and Chips Scale Packaging - Hard Copy & CD-ROM </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AM-102,-APCB%20(Flex),-AM-102%20-%20Flexible%20Circuits%20Compendium,-A,-A,-A">
M-102 - Flexible Circuits Compendium </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-APAS-62123,-APCB%20(Flex),-APAS-62123%20-%20Performance%20Guide%20Manual%20for%20Single%20&%20Double%20Sided%20Flexible%20Printed%20Wiring%20Boards,-A,-A,-A">PAS-62123 - Performance Guide Manual for Single & Double Sided Flexible
Printed Wiring Boards </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-APAS-62249,-APCB%20(Flex),-APAS-62249%20-%20Qualification%20and%20Performance%20Specification%20for%20Flexible%20Printed%20Boards,-A,-A,-A">PAS-62249 - Qualification and Performance Specification for Flexible Printed
Boards </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-AA-31,-APCB%20(Flex),-AA-31%20-%20Flexible%20Raw%20Material%20Test%20Pattern%20-%20Film%20Format,-A,-A,-A">A-31 - Flexible Raw Material Test Pattern - Film Format </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-ATMRC-01F,-APCB%20(Flex),-ATMRC-01F%20-%202001%20Market%20for%20Flexible%20Printed%20Circuit%20Boards,-A,-A,-A">TMRC-01F - 2001 Market for Flexible Printed Circuit Boards </A>
<A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A2315,-ADesign,-A2315%20-%20Design%20Guide%20for%20High%20Density%20Interconnects%20&%20Microvias,-A,-A,-A">2315 - Design Guide for High Density Interconnects & Microvias </A>
New <A HREF="http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-A2226,-ADesign,-A2226%20-%20Sectional%20Design%20Standard%20for%20High%20Density%20Interconnect%20(HDI)%20Boards,-A,-A,-A">2226 - Sectional Design Standard for High Density Interconnect (HDI)
Boards </A>
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
