We're probably mostly asking about inspection criteria regarding the
appearance and placement of the glue dots or beads along the corners of
the BGA. ie gaps or pin-holes.
They're used primarily to reduce the potential for pad cratering.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Harp
Sent: September 9, 2010 2:24 PM
To: [log in to unmask]
Subject: Re: [TN] glue dot standards
Are you referring to corner "staking" of the BGA to reduce stresses in
thermal cycling? If so, you could start with IPC-7095. As far as
acceptability criterion are concerned - these will be application
specific.
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