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February 2001

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Sender:	TechNet <[log in to unmask]>
Subject:	Tombstoning on Palladium termination finish chip capacitor
From:	Jorge Rodriguez <[log in to unmask]>
Date:	Thu, 8 Feb 2001 09:12:51 -0700
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Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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We are having tombstoning issues with this caps from time to time. Trying to
alleviate the problem oven reflow temps were increased to 220 and soak time
was elongated as much as possible, all under solder paste vendor's
recommendations, but it does not seem to help much. Any ideas on what's
advisable to do?. Why is that this termination finish is more difficult?


Any comments would be appreciated.



Jorge Rodriguez
Process Engineer
Varian Electronics Manufacturing
Tempe AZ

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