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January 2000

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Subject:
From:
William Anderson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Jan 2000 15:23:10 -0600
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Greetings.

We're attempting to evaluate electroless/direct metalization processes
for rigid-flex.  We've seen processes that work for rigid and some that
work for flex but nothing that will work consistently void-free for
rigid-flex.  What kind of things are the rest of you using and how do
you rate your success?  All feedback is appreciated.

Thanks.

Bill Anderson
Kinetic Circuits

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