Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="US-ASCII" |
Old-Return-Path: |
|
Date: |
Thu, 11 Apr 96 13:20:23 -0100 |
Precedence: |
list |
Reply-To: |
|
Resent-Sender: |
|
Content-Transfer-Encoding: |
7Bit |
Status: |
O |
X-Mailing-List: |
|
TO: |
|
X-Status: |
|
Return-Path: |
<TechNet-request> |
X-Loop: |
|
Resent-From: |
|
Resent-Message-ID: |
<"PdtGj2.0.cgI.ogERn"@ipc> |
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u7KPD-000072C; Thu, 11 Apr 96 06:19 CDT |
Content-Description: |
<C:\INTERNET\MAIL\QUAL.TXT> |
Subject: |
|
From: |
|
Content-Id: |
<10_46_1_829243234> |
From [log in to unmask] Thu Apr 11 14: |
11:55 1996 |
X-Mailer: |
Ultimedia Mail/2 Lite, IBM T. J. Watson Research Center |
Message-Id: |
<9604112020.AA0012@localhost> |
Parts/Attachments: |
|
|
If I want to qualify my reflow solder process, which documents
(ANSI/IPC, MIL, QQ, ...) could be of use to me ? (Not MIL-STD2000 !)
Help me out, thanks !
**********************************
Ivo de Rooij
Process Engineer
Surface Mount Assembly
Fokker Elmo BV (Fokker Aviation)
P.O. Box 75
4630 AB Hoogerheide
The Netherlands
phone (+31)(0) 164 - 6 17 000
fax (+31)(0) 164 - 6 17 700
e-mail [log in to unmask]
***********************************
|
|
|