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The information may be old but two papers were presented at the 1983
NEPCON West. One was titled "How much gold is enough for electronic
interconnections" by Will Reyes at Xerox. The other was "Palladium-
Nickel as an alternative to Gold in connector applications" by Undegraff
and Graham at du Pont. Some data regarding porosity, HNO3 testing,
contact resistance, etc is included in the papers. I would be happy to
share this information with you if you feel it is of any use.
----------
From: es500yap@pts7
To: [log in to unmask]
Subject: FAB: Palladium Plating
Date: Friday, March 07, 1997 5:00AM
Does any have any experience with Pd plating replacing Selective Au &
ENIG
on
PWB? Are there any success stories? Is there any data collected on the
reliability of this plating? What is the plating thickness like for Ni,
Pd?
Is
Au in the content? If yes, how much?
Appreciate any input.
regards,
stella
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