The issue of microvoids at the solder interface when using immersion silver
as teh final finish was raised approximately a year ago by a major OEM.
Since then all major IAg suppliers have done their homework and corrected
the situation.
You are right most of the corrective action centered around the surface
topography before the IAg step, excessive silver thickness and the acidity of the
silver bath.
The occurrence of excessive micro-voids aligned at the Solder/Copper
interface, also referred to as "Champagne" voids have been reduced dramatically to
the point of elimination.
As in any chemical process, the manufacturer must follow vendor
specifications and keep the process under control to get the desired outcome.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
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