Does anyone have a copy of John Devore's article on slippery
solder? John was a metallurgist at GE's E-Labs in Schenectady. Slippery
solder
was found to be caused by organic deposits on solder pad or
by organic plating levelers that resided in plating porosity. The absorbed
organics
would come out of the porosity upon heating and block solder
wetting. Solder joints would look good but upon light probing would slide
off the pad.
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