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Subject:	IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes
From:	Victor Hernandez <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 5 Sep 2002 07:37:08 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (21 lines)

Fellow TechNetters,

   Is the above test VALID for samples in which ONE or BOTH side of the PTH
have been PLUGGED with an appropriate fill.   Most customers are using VIA
Fill/TINT on PCB/PWB now a days.   In a PREVIOUS LIFE this was not
acceptable.   Is this a common practice.   Nothing is mentioned in the
document

Victor G. Hernandez

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