 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vY17N-0000S6C; Wed, 11 Dec 96 20:43 CST |
| Old-Return-Path: |
|
| Date: |
Wed, 11 Dec 96 21:20:35 EST |
| From [log in to unmask] Thu Dec 12 15: |
57:27 1996 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"yR-FB1.0.P-B.D5tho"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Cc: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
From: Stephen Ayotte
EM Quality Engineering
Bldg. 14-3 Col F5 5-1537
Subject: Fabrication/Repair
Does anybody know of an IPC or industry document that talks about
the processes - hole fill and surface deletes?
Thanks
**** IBM MD Product Quality Engineer ****
**** OEM Quality Engineer ****
**** Interenterprise Address: USIB6CEF ****
**** Internet Address: [log in to unmask] ****
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
