TECHNET Archives

February 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vrjGw-0000SBC; Tue, 4 Feb 97 05:42 CST
Content-Type:
text/plain; charset=US-ASCII
Old-Return-Path:
Date:
Tue, 4 Feb 1997 05:49:47 -0500
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
From [log in to unmask] Wed Feb 5 08:
50:08 1997
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/9912
TO:
[log in to unmask], Jim Marsico 516-595-5879 <[log in to unmask]>
Return-Path:
<TechNet-request>
X-Status:
X-Loop:
Content-Description:
cc:Mail note part
Subject:
From:
Mime-Version:
1.0
Resent-Message-ID:
<"i1WNf.0.xWE.r2ozo"@ipc>
Content-Transfer-Encoding:
7bit
Message-Id:
Parts/Attachments:
text/plain (64 lines)
AIT has a product called ME7158 that we are presently using for space 
application and the bonding of components to PWB's.

On our standard military product we are using a Mereco product 
XLN-589.


Dave


______________________________ Reply Separator _________________________________
Subject: ASSY: THERMAL ADHESIVE
Author:  Jim Marsico 516-595-5879 <[log in to unmask]> at INTERNET
Date:    2/3/97 1:05 PM


I'm looking for a thermal adhesive to use between a component and PWB for 
thermal transfer.  Properties should be close to the following:

        Lap shear               500 psi
        thermal conductivity    4.50 BTU... FT2 (.0065 WATTS/CM C)

The material must also meet the fungus and non-nutrient requirements of 
MIL-STD-454 Requirement 4.  Reworkability is also a requirement... something 
like a one part silicon-based adhesive would be nice.

Thanks

Jim Marsico
(516) 595-5879
[log in to unmask]

                        ********************************
                        *       ______   _   _  _____  *
                        *      / ___  | | | | | _____  *
                        *     / /___| | | | | | _____  *
                        *  __/  ____  | | | | |______  * 
                        * |____/    |_| |_| |________| *
                        *                              *
                        *         SYSTEMS, INC.        *
                        ********************************

*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
*************************************************************************** 
* If you are having a problem with the IPC TechNet forum please contact   * 
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
***************************************************************************

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2