 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tkITU-00005ZC; Wed, 7 Feb 96 16:36 CST |
| Encoding: |
14 TEXT |
| Old-Return-Path: |
|
| Date: |
Wed, 07 Feb 96 17:22:00 EST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"tPOB_1.0.PiC.gbI6n"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| X-Mailer: |
Microsoft Mail V3.0 |
| From [log in to unmask] Wed Feb 7 17: |
12:09 1996 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
Has anyone experienced solder balls with the elimination of
UV bump after thermal cure and specifically with Enthone mask?
How does one go about solving the solder balls problem?
Thanks
Denis Yabo
703- 450-2600
EMail: [log in to unmask]
|
|
|
