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August 1997

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TechNet Mail Forum<[log in to unmask]>
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Tue, 5 Aug 1997 15:13:28 MDT
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"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
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     Hello,

     Many articles recommend rapid cooling rate during rework for reliable
     solder joints. What cooling rate can be readily achieved with most
     rework stations?  One article recommended 100 C in 5 seconds, is it
     reasonable? I thought it would be hard to achieve such a rapid
     cooling.

     Thanks,

     Yuan


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