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February 1999

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Subject:
From:
"Meigs, Jonathan" <[log in to unmask]>
Date:
Thu, 18 Feb 1999 05:30:59 -0700
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Meigs, Jonathan" <[log in to unmask]>
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I would be glad to provide sample of our electrodeposited copper foil for
your evaluation.

Please contact me with details of your requirements (area weight,
dimensions, etc.).

Jonathan Meigs
AlliedSignal Oak-Mitsui
80 First Street
Hoosick Falls, NY 12090
(518)-686-8019

-----Original Message-----
From: Christopher Jorgensen [mailto:[log in to unmask]]
Sent: Wednesday, February 17, 1999 5:53 PM
To: [log in to unmask]
Subject: [TN] Copper Sample Supplier


I was wondering if you could provide a source where I can get copper samples
for
performing a solderability test.  The samples don't necessarily need to be
oxygen
free, as we can bright dip finish them here.  OSP coating is also not a
requirement.
I would appreciate any information you might have.

Thanks again,

Brian Looney
Manufacturing Engineer
Laughlin-Wilt Group
9825 SW Sunshine Ct
Beaverton, OR  97005
(503) 672-4370
fax: (503) 641-9145
email:  [log in to unmask]

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