TECHNET Archives

October 2003

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
"TechNet E-Mail Forum." <[log in to unmask]>
Date:
Fri, 24 Oct 2003 13:34:19 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Tom Parkinson <[log in to unmask]>
Subject:
Re: Sources of Detailed information on gold in a solder joint
From:
Tom Parkinson <[log in to unmask]>
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_0003_01C39A33.87A01210"
In-Reply-To:
<F8B9BBE7074ED511A9F2000629A8E98B0265D839@ASATUS-EXG1>
Organization:
WinTronics, Inc.
MIME-Version:
1.0
Parts/Attachments:
text/plain (3931 bytes) , text/html (14 kB)

ATOM RSS1 RSS2