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November 2003

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Subject:
From:
"Zielfelder, Robert" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 10 Nov 2003 07:04:59 -0500
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Gary,

Thanks for the reply.  But this brings up one more question.  Should the
ground layer represent both connections and non-connections at the same
time?  If so, what is the best way to handle this?  Should every other hole
be "staggered" so that one is a connection and one is a non-connection?

Thanks,

Robert Zielfelder
Tooling Systems Engineer
Tyco Electronics
Printed Circuit Group - Stafford

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gary Ferrari
Sent: Friday, November 07, 2003 5:22 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-2221 Rev A Coupon Design

Robert,

The coupons are to depict the design. So if you have plated through holes
that are connected to an internal plane, the coupon should also have that
pad stack connected on the appropriate layer. If you are making it with a
thermal connection then the same type and sized connection should be made in
the coupon. If you have plane connections that are close to each other than
the coupon should use adjacent pad stacks connected to the internal planes.
The purpose of the coupon is to represent the design as closely as possible.

Regards,

Gary Ferrari
Ferrari Technical Services
860-350-9300
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