TECHNET Archives

May 2014

TechNet@IPC.ORG
Options: Use Proportional Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Sun, 4 May 2014 03:18:10 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Subject:
Solder Mask over Tin Lead Plating
MIME-Version:
1.0
Message-ID:
<[log in to unmask]>
Content-Type:
text/plain; charset="UTF-8"
Content-Transfer-Encoding:
quoted-printable
From:
Ramakrishnan Saravanan <[log in to unmask]>
Parts/Attachments:
text/plain (7 lines) 
Hi,

We received few PCBs from an European PCB manufacturer for Aerospace Industry. I am surprised to see Solder Mask is applied over tin lead plated tracks. My understanding is if u do reflow , the solder under the mask will melt and affect the mask. The correct method is applying Soldermask over bare copper isn't?. Kindly advise. regards,

R.Saravanan

ATOM RSS1 RSS2