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Date: | Sat, 20 Sep 2008 20:37:10 -0700 |
Content-Type: | text/plain |
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Min Jun,
Have you been talking w/ Autosplice? They have quite a bit of
materials expertise. Their hdqtrs is 1 block from my office. I have
an old PCB/backpanel friend who is at executive level there now. If
you'd like I can fwd your e-mail.
dw
At 06:58 PM 9/20/2008, you wrote:
>$B!!!!(BNee hao Min Jun,
>$B!!!!(BFor electroplated nickel obviously you do not have 'back pad'. The
>"brittle failure" may indicate
>$B!!!!(Binsufficient solder temperature.
>Bring yur cross-sections to my workshop and we discuss the issues on Monday
>at IPC Midwest Conference.
>$B!!!!(B
>$B!!!!(BRegards,
>$B!!!!(BWerner Engelmaier
>$B!!!!2DpQ@-@h@8(B
>$B!!!!(BEngelmaier Associates, L.C.
>$B!!!!(BElectronic Packaging, Interconnection and Reliability Consulting
>$B!!!!(B7 Jasmine Run
>$B!!!!(BOrmond Beach, FL 32174 USA
>$B!!!!(BPhone: 386-437-8747, Cell: 386-316-5904
>$B!!!!(BE-mail: [log in to unmask], Website: www.engelmaier.com
>
>
>**************
>
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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