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Date: | Thu, 22 Dec 2005 15:20:30 -0500 |
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IEEE Trans on Comp. Pack. and MFG Tech. Part B Vol. 19 No.3 p.661 (1996)
"Reliability studies of surface mount solder joints-effect of Cu-Sn
intermetallic compounds" by A.So et.al.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lee parker
Sent: Thursday, December 22, 2005 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Intermetalic Layer
George of course is correct!
You can also calculate the thickness of the intermetallic layer. The
equation and constants are in a paper I presented at SMTA on HASL (back when
it was all the rage) in 1990.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: George Milad<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Thursday, December 22, 2005 11:17 AM
Subject: Re: [TN] Intermetalic Layer
The copper tin intermetallic layer thickness will depend on reflow
temperature and time at temperature.
Note: the IMC will grow over time and will not stay fixed.
We have data that was presented in the Lead free IPC/JEDEC conference
showing
the increase in IMC thickness when the joint is subjected to accelerated
age
testing, ( 150 deg C for up to 1000hours).
Best regards
George Milad
National Accounts Manager for tTchnology
Uyemura International Corporation
240 Town Line Rd
Southigton, CT06489
860 793 4011 (O)
516 901 3874 (cell)
[log in to unmask]<mailto:[log in to unmask]>
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